Crystal Integration: Summary of Crystal Integration's 2024 Annual Report
DATE:  Apr 21 2025

Company code: 688249 Company abbreviation: Jinghe Integration

Hefei Jinghe Integrated Circuit Co., Ltd

Summary of the 2024 Annual Report

Section 1 Important Notice

1. The summary of this annual report is from the full text of the annual report, in order to fully understand the company's operating results, financial status and future development plan, investors should go to the www.sse.com.cn website to read the full text of the annual report carefully.

2. Major risk warning

The Company has elaborated in this report on the various risks that the Company may face in the course of its operation, please refer to "Section 3 Management Discussion and Analysis" of this report "IV. Risk Factors", and investors are advised to pay attention to investment risks.

3. The Board of Directors, the Board of Supervisors, the directors, supervisors and senior management of the Company guarantee the authenticity, accuracy and completeness of the contents of the annual report, and that there are no false records, misleading statements or material omissions, and bear individual and joint legal liabilities.

4. All directors of the company attend the meeting of the board of directors.

5. Rongcheng Certified Public Accountants (Special General Partnership) issued a standard unqualified audit report for the company.

6. The company is not profitable and has not yet achieved profitability at the time of listing

□ Yes √ No

7. The profit distribution plan or the plan for the conversion of provident fund into share capital for the reporting period approved by the board of directors

On April 18, 2025, the company held the 19th meeting of the second session of the board of directors to deliberate and pass the "Proposal on the 2024 Profit Distribution Plan", the company intends to distribute profits based on the total share capital registered on the record date of equity distribution minus the shares in the company's special securities account for repurchase, and distribute cash dividends of 1.00 yuan (tax included) to all shareholders for every 10 shares.

As of the disclosure date of this report, the company's total share capital is 2,006,135,157 shares, deducting 62,088,500 shares in the special securities account for repurchase, and the total proposed cash dividend is 194,404,665.70 yuan (tax included). During the year, the amount of share repurchase implemented by centralized bidding was RMB 891,677,308.30 (excluding stamp duty, transaction commissions and other transaction costs), and the total amount of cash dividends and repurchases was RMB 1,086,081,974.00, accounting for 203.83% of the net profit attributable to shareholders of the listed company for the year. Among them, the repurchase amount of shares repurchased and cancelled by centralized bidding was 0 yuan with cash as consideration, and the total amount of cash dividends and repurchase and cancellation was 194,404,665.70 yuan, accounting for 36.48% of the net profit attributable to shareholders of listed companies for the year.

During the period from the disclosure of the profit distribution plan to the registration date of the implementation of equity distribution, if there is a change in the number of shares to be distributed by the company (the total share capital minus the balance of shares in the company's special securities account for repurchase), the company intends to maintain the distribution ratio per share unchanged, adjust the total amount of distribution accordingly, and announce the specific adjustment separately.

The company's profit distribution plan for 2024 still needs to be submitted to the shareholders' meeting for deliberation.

8. Whether there are special arrangements for corporate governance and other important matters

□ Applicable √ Not applicable

Section 2 Basic information of the company

1. Company profile

1.1 Company Shares

√ Applicable □ Not applicable

Company stock profile

Stock Type Stock Listed Exchange and Sector Stock Abbreviation Stock Code Stock Abbreviation Before the Change

RMB Ordinary Shares (A Shares) Shanghai Stock Exchange's Science and Technology Innovation Board Crystal Integration 688249 Not applicable

1.2 Brief description of the Company's Depositary Receipts

□ Applicable √ Not applicable

1.3 Contacts and Contact Details

Secretary of the Board of Directors and Representative of Securities Affairs

Name: Zhu Caiwei, Cao Zongye

Address: Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei City, Anhui Province Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei City, Anhui Province

No. 88 Xiqihe Road No. 88 Xiqihe Road

Tel: 0551-62637000 ext. 612688 0551-62637000 ext. 612688

Fax: 0551-62636000 0551-62636000

E-mail stock@nexchip.com.cn stock@nexchip.com.cn

2. Brief introduction of the company's main business during the reporting period

2.1 Main business, main products or services

The company is mainly engaged in 12-inch wafer foundry business and its supporting services. The company is committed to R&D and application of advanced technology in the industry, providing customers with a variety of process nodes and process platform wafer foundry services for multiple applications, and providing supporting services such as lithography mask manufacturing.

In terms of foundry process nodes, the company has achieved mass production of 150nm to 55nm process platforms with 40nm high during the reporting period

The OLED display driver chip is produced in small batches, the 28nm logic chip has passed the functional verification and successfully lit up the TV panel, and the research and development of other products on the 28nm process platform is steadily advancing. In terms of process platform applications, the company has the technical capabilities of wafer foundry for process platforms such as display driver chips (DDIC), CMOS image sensor chips (CIS), power management chips (PMIC), microcontroller chips (MCU), and logic chips (Logic). The company's products are mainly used in smart phones, flat panel displays, security, automotive electronics, household appliances, industrial control, Internet of Things and other fields.

2.2 Main business model

1. R&D model

The company has formulated a R&D management system, clarified the rights and responsibilities of each department in the R&D process and the operation process, and ensured the R&D process

In line with the company's strategic development direction, to maximize operating benefits. The company's R&D process includes market research, strategy formulation, feasibility assessment, project review, technology development, tape-out, process verification and other links. In order to ensure R&D efficiency and cost control, the company has also formulated a strict R&D progress control plan.

2. Procurement model

In order to strengthen cost control, ensure the quality of wafer foundry services, and improve production efficiency and inventory turnover efficiency, the company has established a strict procurement process, a perfect supplier certification and access mechanism and a strict supplier assessment and evaluation system to ensure the stability of raw materials, equipment spare parts and equipment quality and the sustainability of supply.

The company's suppliers mainly include raw material suppliers and equipment suppliers, the company usually adopts a direct procurement model, if the terminal supplier adopts the distribution model for sales, the company can also purchase from the terminal supplier through the distributor. Suppliers can become qualified suppliers of the company after passing the qualification assessment, procurement benefit evaluation, factory evaluation and other links, and the company mainly purchases from suppliers who have entered the company's qualified supplier list. Subsequently, the relevant departments will assess and evaluate the quality, price, and service of the purchased products, so as to realize the closed-loop management of the procurement process.

3. Production mode

After receiving customer demand, the company first conducts small-scale trial production; After the yield and process conditions are stable, it enters the stage of risk mass production; After the delivery indicators are met, we will sign a formal sales contract with the customer or accept bulk orders, allocate production capacity, formulate production plans, and carry out mass production according to customer needs.

4. Sales model

The company has established a standardized and complete sales team, has diversified marketing channels, and expands customers through different marketing methods. The company adopts the direct sales model for sales, and has formulated a corresponding sales management system to standardize the sales process.

2.3 The situation of the industry

(1). The development stage, basic characteristics and main technical thresholds of the industry

The company is mainly engaged in 12-inch wafer foundry business and its supporting services. According to the Industrial Classification of the National Economy (GB/T4754-2017), the company is in the manufacturing of computers, communications and other electronic equipment (C39). According to the Classification of Strategic Emerging Industries (2018) (Decree No. 23 of the National Bureau of Statistics) of the National Bureau of Statistics, the industry in which the company is located is "new electronic components and equipment manufacturing" (classification code: 1.2.1) and "integrated circuit manufacturing" (classification code: 1.2.4) in the classification of strategic emerging industries.

As the core of the information technology industry, the semiconductor industry is significantly strategic, fundamental and leading. Semiconductor products are mainly divided into discrete devices and integrated circuits, of which integrated circuit (IC) is a kind of miniature electronic device with complete and complex circuit functions, which realizes the interconnection of transistors, resistors, capacitors, inductors and other components and metal wiring through a special integrated circuit manufacturing process, and integrates them on one or several semiconductor wafers. Integrated circuits are widely used in computers, communications, consumer electronics (mobile phones, televisions, computers, etc.), medical, industrial automation, military and other fields, playing an important role in national security, economic construction and people's daily life, and are the indispensable cornerstone of modern society.

The integrated circuit industry presents a vertical division of labor pattern, including integrated circuit materials, integrated circuit equipment, etc.; The midstream is the production of integrated circuits, and the production of integrated circuits also presents a vertical division of labor, which can be specifically divided into integrated circuit design, integrated circuit manufacturing, and integrated circuit packaging and testing; The downstream of the integrated circuit industry is a variety of terminal applications.

In recent years, with the continuous advancement of the global information trend, the application field of integrated circuits has achieved rapid expansion and gradually become one of the core pillar industries of the global economy. The full-scale explosion of generative artificial intelligence (AI) in 2024 will drive the growth of the semiconductor market. In the era of artificial intelligence, there is huge room for innovation in integrated circuit applications, including sensing, storage, communication, security, and energy. In 2024, the implementation of end-to-end AI technology in terminal devices such as mobile phones, PCs, wearables, and the Internet of Things (IoT) will accelerate, and consumer electronics terminal products will continue to iterate in terms of software, hardware, product forms and versions in the future, and new technologies and new applications will bring the need to purchase upgraded devices. In addition to AI, emerging industries such as new energy vehicles, intelligent manufacturing, and the Internet of Things are all boosters for the vigorous development of the semiconductor industry.

At present, China is the world's major electronic information manufacturing production base, and it is also the world's largest and fastest-growing integrated electricity

Road Market. According to China's customs statistics, China's integrated circuit output will be 451.4 billion in 2024, a year-on-year increase of 22.2%; Export integrated electricity

298.11 billion roads, up 11.6% year-on-year, and exports reached 1.14 trillion yuan, up 18.7% year-on-year. Overall, 2024

In the past year, China's electronic information manufacturing industry has maintained a steady growth trend, especially in the field of integrated circuits, and the export market has picked up. In the future, with the acceleration of the domestic substitution process of the integrated circuit industry, and driven by the demand for new applications such as artificial intelligence, 5G, cloud computing, and intelligent networked vehicles, the integrated circuit industry in Chinese mainland will gain more development opportunities.

The company is in the integrated circuit wafer foundry industry. Wafer foundry enterprises do not include integrated circuit design, but are responsible for wafer manufacturing and provide wafer foundry services for integrated circuit design companies. The wafer foundry industry is a technology, capital, and talent-intensive industry, which requires a large amount of capital and talent investment. The chip manufacturing process is highly complex, requires a wide variety of raw materials and equipment, and has a long manufacturing cycle, which requires the support of the global industrial chain, in-depth professional knowledge and engineering talents, and the ability to continue technological innovation and process technology accumulation, with high barriers to entry.

(2). Analysis of the company's position in the industry and its changes

Based on the field of wafer foundry, relying on the manufacturing experience of mature manufacturing process and based on panel display driver chips, the company has gained good industry recognition, and its customer base covers some international first-line companies; At the same time, in the fields of image sensor chips, power management chips, microcontroller chips, etc., the company has also established long-term and stable cooperative relations with leading chip design companies in the industry at home and abroad. At present, the company's market share in the field of LCD panel display driver chip foundry is in a leading position in the world. According to the Q4 2024 Global Wafer Foundry Revenue Ranking released by TrendForce, ChipForce ranked ninth in the world and third among Chinese mainland companies.

(3) The development and future development trend of new technologies, new industries, new forms of business and new models during the reporting period

(1) The development of the OLED panel industry brings new opportunities

OLED panel is a display made of organic self-emitting diodes, which has the characteristics of no backlight, high contrast, thin thickness, wide viewing angle, fast response speed, and can be used for flexible panels, with excellent image quality, healthy eye protection, energy saving and power saving. Flexible OLED panels are quickly gaining traction with their vibrant colors, ultra-thin design, and wider viewing angles. With the widespread adoption of 5G technology and the emergence of more high-performance applications, the demand for high-quality displays will continue to grow. According to data from Sigmaintell, the global demand for OLED smartphone brands will be about 820 million pieces in 2024, with a penetration rate of 55.9%.

Among them, the demand for flexible OLED panels is about 620 million, accounting for 42% of the total penetration, and OLED will be in demand for global smartphone brands in 2025

It will reach 860 million pieces, and the penetration rate will increase to 57.5%, of which the brand's demand for flexible OLED will be about 670 million, accounting for 44.9%.

OLED driver chips are the core components of OLED panels, and with the growth of demand for OLED panels, OLED display driver chip shipments are available

Hope to continue to improve.

The company is actively deployed in the field of OLED display driver chip foundry, and will have a complete OLED driver chip process platform in the future.

At present, the company's 40nm high-voltage OLED display driver chip has achieved mass production, and the research and development of 28nm OLED display driver chip is progressing smoothly.

(2) The localization process of CIS is accelerating

In recent years, global CIS sales have generally shown steady growth. According to Yole data forecasts, the global CIS market is expected to grow by 2028

The market size will further grow to $28.8 billion, growing at a CAGR of 5.1% from 2022 to 2028. For a long time, high-performance CIS

It is mainly supplied by Sony and Samsung, but at present, domestic CIS has formed a breakthrough in the mainstream 50MP products in the mobile phone market. in the country

Under the wave of domestic substitution, local leading CIS manufacturers have many advantages, and the technology gap is narrowing, and the attitude of domestic enterprises actively embracing local manufacturers is also relatively clear, which is in line with the general trend of state-led technology import substitution, independent and controllable. In addition to the mobile phone market, the automotive market has also become a new driver of CIS growth. With the rapid development of intelligent and connected vehicles, the market demand for advanced driver assistance systems is strong, driving the sales growth of automotive camera modules and CIS. According to statistics, the use of bicycle cameras is expected to rise in the future, bringing huge growth potential to the CIS market. Therefore, with the recovery of smartphones, security, industry and other fields, the rise of new energy vehicles, the rapid penetration of emerging fields such as drones, AR/VR, and machine vision, and the acceleration of the process of localization substitution, the CIS market will continue to grow.

In 2024, the company's 55nm mid-to-high-end BSI and stacked CIS chip process platform will achieve mass production, and the product pixels will reach 5000

The products are widely used in the main camera, auxiliary camera and front camera lens of smart phones, etc., and the company's products have been successfully upgraded from low-end applications to high-end applications.

(3) The automotive chip market is growing rapidly

The semiconductor content of new energy vehicles is two to three times that of traditional internal combustion engine vehicles, and the amount of automotive chips with assisted driving and intelligent cockpit functions is higher. At present, with the development of the global new energy vehicle industry, the pace of transformation of the "New Four Modernizations" of automobiles is accelerating, and automotive chips have become an important carrier to improve the intelligent driving experience, ushering in a wave of rapid development.

The company actively cooperates with the needs of the automotive industry chain and lays out the automotive chip market. In terms of automotive chip manufacturing capacity building, the company has obtained the international automotive industry quality management system certification, and has passed the vehicle specification verification of multiple process platforms. At present, 55nm automotive display driver chips have been mass-produced.

(4) The demand for power management chips is growing

Power management chip is a chip that realizes the conversion, distribution, detection and other power management responsibilities of electric energy in the electronic equipment system, and is an indispensable key device in electronic products. Power management chips will directly affect the performance of electronic devices, and they are also an indispensable type of chip in modern electronic products, and almost all electrical and electronic systems use power management chips. Due to the wide range of application scenarios, the rapid development of the downstream application market, and the continuous emergence of new application scenarios and fields, power management chips have developed rapidly. In the future, with the development of new industries such as artificial intelligence, big data, and the Internet of Things, the number and types of electronic devices required by the world will grow rapidly, and the application range of power supply and battery management chips will be more extensive, the functions will be more diverse and complex, and the demand for efficiency and energy saving will be more prominent.

Power management chips have become the company's third largest product spindle, accounting for about 9% of revenue in 2024. At present, the company is conducting the research and development of 90-110nm BCD power management chips, and the company's products will be used in more fields in the future.

(5) The development of emerging application fields such as AR/VR accelerates the application of microdisplay technology

VR, AR, MR and other technologies are collectively referred to as XR (Extended Reality), Chinese called Extended Reality, refers to the reality and virtuality

The wearable device that is intended to be combined for human-computer interaction brings virtuality to the experiencer by integrating the visual interaction technology of the three

"Immersion" that seamlessly transitions between the world and the real world. At present, the mainstream XR includes VR, virtual reality, AR, augmented reality,

MR, mixed reality, etc. XR is considered to be the next generation of mobile computing platforms based on its more three-dimensional display, more direct and realistic interaction, and spatial computing capabilities. As a hardware carrier that connects reality and virtual scenes, VR/AR/MR related products have been attracting attention in recent years

Concern. According to IDC China, China's AR/VR market is expected to ship 535,000 units in 2024, down 26.3% year-on-year. exhaust

Although facing uncertainties such as macroeconomic and consumer purchasing power fluctuations, product technology innovation, AI additions, and the entry of new manufacturers will be

Driving the market recovery, China's AR/VR market shipments will increase by 114.7% in 2025, with the AR market growing particularly significantly.

Micro OLED, also known as silicon-based OLED, is an OLED technology applied in the field of microdisplays.

A new flat panel display technology that fabricates OLED display devices on a substrate that integrates a traditionally externally bound display chip in a silicon-based backplane. Compared to OLEDs, Micro OLED technology enables higher pixel density and resolution, faster response times, and no need for complex packaging techniques at a lower cost. Benefiting from the demand of the XR industry, the market size is rapidly expanding.

For AR/VR micro display technology, the company is developing silicon-based OLED related technologies, and has cooperated with leading companies at home and abroad

Carry out in-depth cooperation. At present, the 110nm Micro OLED chip has successfully lit up the panel, and the product research and development is progressing smoothly.

3. The company's main accounting data and financial indicators

3.1 Key accounting data and financial indicators for the past 3 years

Unit: Yuan Currency: RMB

2024 2023 This year is compared to 2022

Increase/decrease (%)

Total assets 50,398,579,443.20 48,156,279,600.77 4.66 38,764,574,541.96

Attributable to listed companies 20,870,311,007.81 21,409,804,721.09 -2.52 13,124,156,593.71

Net worth of shareholders

Operating income 9,249,252,348.20 7,243,541,372.63 27.69 10,050,948,608.55

Attributable to listed companies 532,840,611.25 211,629,145.60 151.78 3,045,430,810.29

Net profit to shareholders

Attributable to listed companies

Shareholders' deductions are not 394,366,803.85 47,129,534.95 736.77 2,878,346,415.27

Net profit from recurring gains and losses

moistening

2,761,131,250.90 -161,035,964.85 Not applicable 6,280,033,397.39 arising from operating activities

Net cash flow

Weighted average net assets 2.52 1.09 increased by 1.43 percentage points 26.91

Yield (%)

Basic earnings per share (RMB 0.27 0.12 125.00 2.02

/share)

Diluted earnings per share (RMB 0.27 0.12 125.00 2.02

/share)

R&D investment accounted for 13.88 14.60 percentage points of revenue, down 0.72 percentage points 8.53

Percentage of income (%)

3.2 Key accounting data by quarter in the reporting period

Unit: Yuan Currency: RMB

Q1 Q2 Q3 Q4

(January-March) (April-June) (July-September) (October-December)

Operating income 2,227,893,274.41 2,169,883,982.29 2,377,274,489.11 2,474,200,602.39

Attributable to listed companies 79,258,819.88 107,743,718.00 91,932,173.17 253,905,900.20

Net profit to shareholders

Attributable to listed companies

Shareholders' deductions are not 57,309,730.50 37,365,152.44 84,700,556.85 214,991,364.06

Net after recurring gains and losses

profit

394,884,867.30 900,280,528.06 671,436,552.42 794,529,303.12

Net cash flow

Explanation of the discrepancies between the quarterly data and the data disclosed in the periodic report

□ Applicable √ Not applicable

4. Shareholders

4.1 The total number of common shareholders, the total number of preferred shareholders whose voting rights have been restored, and the total number of shareholders holding special voting shares and the top 10

shareholders

Unit: Shares

As of the end of the reporting period, the total number of ordinary shareholders (households) was 68,966

The total number of ordinary shareholders (households) at the end of the previous month prior to the disclosure date of the annual report was 65,318

The total number of preferred shareholders whose voting rights have been restored as of the end of the reporting period (households) is not applicable

The total number of preferred shareholders whose voting rights were restored at the end of the previous month prior to the disclosure date of the annual report is not applicable

The total number of shareholders holding special voting shares as of the end of the reporting period (households) Not applicable

The total number of shareholders holding special voting shares at the end of the month prior to the disclosure date of the annual report is not applicable

Shareholdings of the top 10 shareholders (excluding shares lent through refinancing)

Staking, tokenizing

or freeze the situation

Hold a limited sale

Name of Shareholder During the Reporting Period Number of Shares Held at the End of the Period Proportion Number of Conditional Shares Shareholder

(Full name) increase or decrease (%) number of shares nature

The amount of status

Hefei Construction Investment Control 0 468,474,592 23.35 468,474,592 None 0 State-owned legal person

shares (group) limited company

Powerchip Innovation Investment Holdings -30,092,027 382,732,181 19.08 0 None 0 Overseas legal person

corporation

Hefei core screen industry investment 0 328,736,799 16.39 328,736,799 none 0 other

Fund (Limited Partnership)

Midea's limited investment in innovation -25,255,000 62,759,118 3.13 0 N/A 0 Non-national country

The company has a legal person

China Merchants Bank Co., Ltd

Company-China Shanghai Securities Branch

50 Component Trading 44,254,350 44,254,350 2.21 0 None 0 Other

Open-ended index securities investment

funds

Industrial and Commercial Bank of China shares

Co., Ltd. - E Fund

SSE STAR Market 50 Components 34,206,408 34,206,408 1.71 0 None 0 Others

ETFs

Securities investment funds

Beijing Chipone North Technology -7,267,594 26,523,451 1.32 0 None 0 Domestic non-state

A company limited by shares has a legal person

Anhui Chuanggu equity investment

Fund Management Limited

-Hefei Zhongan Zhixin -20,061,351 19,545,003 0.97 0 None 0 Others

Right to invest in a partnership (Yes

Partnership Only)

CITIC Securities Co., Ltd

Company-Harvest SSE

Chip: Transactional 17,275,445 17,275,445 0.86 0 None 0 Other

Investments in open-ended index securities

funds

SME Development Fund

(Shenzhen Nanshan Co., Ltd. 0 13,202,118 0.66 0 None 0 Other.)

Gang)

Hefei Xinping and Hefei Construction Investment are acting in concert. Besides

Description of the above-mentioned shareholder affiliation or concerted action The Company does not know whether there is an affiliation among the above-mentioned other shareholders

or a person acting in concert.

Explanation of preferred shareholders whose voting rights have been restored and the number of shares held None

Holders of depositary receipts

□ Applicable √ Not applicable

The top 10 shareholders in terms of the number of voting rights as of the end of the reporting period

□ Applicable √ Not applicable

4.2 Block diagram of the property rights and control relationship between the company and the controlling shareholder

√ Applicable □ Not applicable

4.3 Block diagram of the property rights and control relationship between the company and the actual controller

√ Applicable □ Not applicable

4.4 The total number of preferred shareholders and the top 10 shareholders of the company at the end of the reporting period

□ Applicable √ Not applicable

5. Corporate bonds

√ Applicable □ Not applicable

5.1 All bonds of the Company in existence as at the date of approval of the annual report

Unit: Yuan Currency: RMB

Bond Name Abbreviation Code Maturity Date Bond Balance Interest Rate (%)

Hefei Crystal Integrated Circuit Co., Ltd. 24 Crystal Integration

Co., Ltd. 2024 No. 1 MTN001 ( Branch 102483400 2029-08-09 800,000,000 1.90

Medium-term notes (science and technology innovation notes)

5.2 Interest payments and redemption of bonds during the reporting period

□ Applicable √ Not applicable

5.3 Adjustments to the credit rating results of companies or bonds made by credit rating agencies during the reporting period

□ Applicable √ Not applicable

5.4 The company's main accounting data and financial indicators in the past 2 years

√ Applicable □ Not applicable

Unit: Yuan Currency: RMB

Main indicators 2024 2023 Change from the same period last year (%)

Asset-liability ratio (%) 48.23 54.03 decreased by 5.80 percentage points

Deductions attributable to shareholders of listed companies 394,366,803.85 47,129,534.95 736.77

Net profit from non-recurring gains and losses

EBITDA Total Debt Ratio 22.99 27.77 -17.21

Interest protection ratio 1.68 1.31 28.24

Section 3: Important Matters

1. The company shall, in accordance with the principle of materiality, disclose the major changes in the company's operation during the reporting period, as well as the events that have a significant impact on the company's operation during the reporting period and are expected to have a significant impact in the future.

During the reporting period, the company achieved operating income of 9249.2523 million yuan, an increase of 27.69% over the same period of last year; The net profit was 48,219.63

10,000 yuan, an increase of 304.65% over the same period of the previous year; the net profit attributable to the owners of the parent company was 532.8406 million yuan, an increase of 151.78% over the same period of last year; The net profit attributable to the owners of the parent company after deducting non-recurring gains and losses was 394.3668 million yuan, compared with the same period last year

an increase of 736.77%; The net operating cash flow was 2761.1313 million yuan, an increase of 2922.1672 million yuan over the same period of last year.

2. If there is a delisting risk warning or termination of listing after the disclosure of the company's annual report, the reasons for the delisting risk warning or termination of listing shall be disclosed.

□ Applicable √ Not applicable

Follow Yicai Global on

star50stocks

Ticker Name

Percentage Change

Inclusion Date