Chinese Chipmaker Houmo.AI Bags USD46.3 Million in Pre-A Fundraiser
Xu Wei
DATE:  Aug 24 2021
/ SOURCE:  Yicai
Chinese Chipmaker Houmo.AI Bags USD46.3 Million in Pre-A Fundraiser Chinese Chipmaker Houmo.AI Bags USD46.3 Million in Pre-A Fundraiser

(Yicai Global) Aug. 24 -- Huomo.Ai, a Chinese computing chipmaker, said it has secures CNY300 million (USD46.3 million) in a pre-A financing round.

The fundraiser was led by Qiming Venture Partners. Existing shareholder Matrix Partners China and other investors such as MSA Capital and Zhongguancun Development Qihang, also took part, the Nanjing-based firm said in a press release today. 

The proceeds will be mainly used to accelerate the research and development of chip product technology, talent acquisition, early market layout and commercialization.

This is the second fundraiser the firm has completed in the last six months, as it wrapped up an angel financing round in March, raising tens of millions of dollars.

Houmo.AI’s exploration and progress in the integration of storage and computing power is ahead of other enterprises in China, and it is expected to be the first one to realize the application of artificial intelligence chips’ integrating storage and computing on a large scale, said Wang Huadong, partner at Matrix Partners China in the press release.

Founded at the end of last year, Houmo.AI supplies chips with large computing power based on integrated storage and calculation technology which can be applied to various scenarios like unmanned vehicles, pan-robots, cloud recommendation, as well as image analysis.

Editor: Futura Costaglione

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Keywords:   Chip,Investment