China Securities Intelligent Financial News Huahai Qingke (688120) announced on the evening of September 26 that recently, the company's first 12-inch single-chip terminal cleaning machine HSC-F3400 machine was sent out to the leading domestic large silicon wafer enterprises. This product is another important layout of the company's wet equipment series after CMP equipment and thinning equipment, which will have a positive impact on the company's future development.

the announcement shows that the HSC-F3400 model is a high-performance equipment developed by the company for the special needs of the large silicon wafer terminal cleaning market. the model is equipped with a new cleaning module, a drying module and a particle and metal pollution control system, which can stably realize high-efficiency ultra-clean cleaning of the front and back of large silicon wafers. The high-performance chuck clamping technology on the machine ensures stable and high-speed operation of the wafer. While the production capacity advantage is obvious, it has the characteristics of high safety, flexible process adjustment and strong reliability, and can meet low-cost operation and maintenance requirements with a long service life.

The announcement stated that the shipment of the first 12-inch single-chip terminal cleaning machine is another important layout for the company to develop in an all-round way based on industrialization and facing market demand. It will have a positive impact on the company's future development and will help the company. Practice the platform development strategy of "equipment service.

Huahai Qingke is mainly engaged in the research, production, marketing and technical services of semiconductor special equipment. The company has made effective breakthroughs and system layout in key technical aspects such as nano-scale polishing, on-line detection of nano-precision film thickness, ultra-clean cleaning of nano-scale particles, big data analysis and intelligent control, and has developed Universal series CMP equipment, Versatile series thinning equipment, HSC series cleaning equipment, HSDS/HCDS series liquid supply system, film thickness measurement equipment, as well as technical services such as wafer regeneration, key consumables and maintenance services. The company's main products and services have been widely used in integrated circuits, advanced packaging, large silicon wafers, third-generation semiconductors, MEMS, MicroLED and other manufacturing processes.

In the first half of 2023, the company achieved total operating income of 1.234 billion billion yuan, a year-on-year increase of 72.12; net profit attributable to the parent company was 0.374 billion billion yuan, a year-on-year increase of 101.44.