On March 26, 2025, Tuojing Technology (688072) held a new product launch conference with the theme of "Tuoxin Chapter, See the Future" on the first day of the SEMICON China 2025 exhibition, focusing on the release of ALD series, 3D-IC and advanced packaging series, and CVD series of new products, fully demonstrating its technological breakthroughs and industrial layout in the field of semiconductor thin film deposition and advanced packaging, attracting hundreds of guests such as industry leaders, media and investors to witness.

Hardcore technology is released, defining a new height in the industry

At the beginning of the press conference, Dr. Lv Guangquan, chairman of the board of directors, systematically expounded the technology research and development and product strategy of Tuojing Technology. He pointed out that relying on years of technology accumulation, the company has moved from front-end thin film equipment to 3D-IC equipment, and the shipment of reaction chambers will exceed 1,000 units in 2024. In 2025, Tuojing will maintain high R&D investment, continue to upgrade products, meet customers' mass production and R&D needs, and realize the strategic upgrade from "domestic substitution" to "technology leadership".

Subsequently, the three strategic new products were announced one by one: Dr. Chen Xinyi, general manager of the ALD business department, said that Tuojing has achieved the first installed capacity of ALD equipment and the first ALD thin film process coverage in China, and explained in detail the advantages of the new generation of atomic layer deposition equipment VS-300T in terms of ping efficiency ratio, cost (CoO), film uniformity and other aspects.

Mr. Guo Wanli, General Manager of 3D-IC and Advanced Packaging Division, elaborated on the layout of Tuojing in bonding and related products, achieving the first place in the installed capacity of domestic bonding equipment and bonding-related process coverage. This new product launch introduces the Dione 300F, a low-stress fusion bonding device, the Pleione, a chip-to-wafer hybrid bonding device, a Lyra laser stripping device, and the Crux 300 bonding register accuracy measurement machine.

Ning Jianping, general manager of CVD Division, introduced that Tuojing Technology's CVD application capabilities have been fully affirmed by the market and customers, and the current R&D direction is mainly focused on improving customer production efficiency. She pointed out that the CVD division will ship 10 new products from 2023 to 2024, and at the same time launch a new platform PF-300M with high capacity and high cost performance, achieving the goal of increasing thick film production capacity, integrating processes and improving efficiency. The sharing of the three technical leaders highlights the hard core strength of the extension and expansion of Tuojing Technology's semiconductor manufacturing technology.

The opening ceremony set off a climax and drew a new blueprint for the industry

After the three persons in charge introduced the new products, the conference ushered in the most exciting opening session. In the countdown of hundreds of guests, Chairman Lv Guangquan and the three heads of the business department jointly unveiled the curtain of the new product model, the LED large screen simultaneously presented a dynamic technology demonstration, and the magnificent music pushed the atmosphere to a climax.

This conference is not only a concentrated display of Tuojing Technology's technical strength, but also injects new vitality into China's semiconductor equipment industry. Driven by the two-wheel drive of "independent innovation" and "international competition and cooperation", Tuojing Technology is redefining the industry boundary with hard-core technology and opening a new chapter in China's semiconductor equipment.