(Yicai) July 27 -- Lens Technology, a leading Chinese precision component manufacturer, has signed a memorandum of understanding with US chipmaker Intel Corporation to jointly promote through glass via (TGV) advanced packaging technology, expanding its ambitions in semiconductor packaging.

The recent agreement identifies TGV advanced packaging as the two companies' primary area of cooperation. They will discuss and evaluate potential projects covering key manufacturing processes, including TGV, high-precision laser processing, plated through-hole (PTH) metallization and multi-layer interconnection, according to the Changsha-headquartered company's announcement.

TGV glass substrates are emerging as a key platform for AI computing chips and co-packaged optics, thanks to their low thermal deformation, high-frequency performance, low signal loss and suitability for large-scale production.

Under the memorandum, Intel will regard Lens Technology as a valuable potential partner in TGV advanced packaging, provide relevant technical specifications and support efforts to apply the technology to artificial intelligence computing chip packaging. Any specific cooperation projects, however, will require separate written agreements before they proceed.

The companies also plan to explore cooperation in complementary fields, including AI personal computer structures and modules, high-reliability structural components and cooling modules for data center servers, embodied AI robots, industrial intelligent devices and edge computing hardware.

TGV Technology Targets AI Chip Packaging

Lens Technology said it has built up long-term expertise in TGV precision machining, micro-hole forming, PTH metallization and multi-layer interconnection, and has established pilot production lines and conducted sample trials. The company said the partnership will help establish a long-term strategic relationship based on mutual trust.

The partnership with Intel is expected to accelerate the commercialization of glass-substrate advanced packaging technology while helping Lens Technology expand from consumer electronics structural components into the semiconductor advanced packaging substrate market and deepen its integration with the global computing hardware supply chain.

Before Lens Technology's partnership with Intel, one of the cooperation projects announced in May by Chinese display panel maker BOE Technology Group and US glass manufacturer Corning was the joint development of TGV-based advanced packaging substrates.

Lens Technology [SHE: 300433] closed down 1.9 percent at CNY36.63 (USD5.40) today. The stock has retreated almost 40 percent since reaching a record intraday high on June 25.

Editor: Emmi Laine